Reliability - CML Microcircuits

Reliability

Design for Reliability

New products are only approved for production after undergoing the CML approved formal design process that has been certified to ISO 9001:2015.

A design authority is allocated at the conceptual stage of the project. This person is responsible for the technical aspects of the design, both throughout the design stages and during the lifetime of the product.

Design rules automatically check and ensure that IC layouts comply with the appropriate requirements for the design and technology.
Design verification includes automated simulation, design checking, layout checking, evaluation of prototypes and characterisation.
Design reviews are held at critical stages throughout the design. This ensures that all necessary requirements have been met before continuing on to the next stage of the design process.

 

Manufacture for Reliability

Package manufacturing is carried out at the CML assembly facility certified to ISO 9001:2015 or by similarly qualified outside sources.
A process owner is allocated to each process used within the CML production life cycle. The person is responsible for all process qualification and approval.

The CML Quality Managers are responsible for ensuring that reliability qualification tests are planned, carried out, and any problems resolved.

 

Reliability Qualification Test Items and Conditions

Typical conditions for reliability qualification tests are illustrated below:

 Test ItemsTest ConditionsReference StandardQualification SampleAction
Life TestOperating Life TestTA 125°C : 1000 hoursMil Std 883K
Method 1005.10
40 Minimum (normally77)Report FIT Rate
Stress TestLatchup1.5 x Vdd max. 100mA max. I trigger
-0.5 x Vdd max -100mA max I trigger
1.5 x Vdd max V supply volts overload
EIA/JESD78D6Results as Recorded
ESDHuman Model up to 4000VMil Std 883K
Method 3015.8
6Results as Recorded
Environmental TestTemperature Cycle[1]-65°C to 150°C : 500 cyclesCycles
Mil Std 883K
Method 1010.8
45Accept/Reject
0 / 1
High Temperature
Store
TA 150°C : 1000 hoursMil Std 883K
Method 1008.2
45Accept/Reject
0 / 1
Low Temperature
Store
TA -65°C : 1000 hoursEIAJ ED-
4701/202
45Accept/Reject
0 / 1
PCT121°C RH 100% : 96 hoursJESD22-A102E45Accept/Reject
0 / 1
Thermal Shock-65°C to +150°C : 100 cycles
or
-55°C to +125°C : 300 cycle
Mil Std 883K
Method 1011.9
45Accept/Reject
0 / 1
Mechanical TestResistance to
Soldering Heat
Test
260°±5° CMil Std 750-2A
Method 2031.5
Condition B
10Accept/Reject
0 / 1
Solderability245°C : 5 seconds
Flux Used
Mil Std 883K
Method 2003.9
10Accept/Reject
0 / 1
Lead FatigueBend 90°
3 cycles
Mil Std 883K
Method 2004.6
10Accept/Reject
0 / 1
Lead Tension250 grams pull
30 seconds
Mil Std 883K
Method 2004.6
10Accept/Reject
0 / 1
Marking Permanence3 Solvent Solutions
1 Minute Soak
30 Brush Strokes
Mil Std 883K
Method 2015.13
8 per SolventAccept/Reject
0 / 1

[1] May be replaced by Thermal Shock

 

Ask a question

Request a quote