IC Package Dimensions
This section is intended to give you access to up-to-date CML (encapsulation) package information.
CML publications containing specifications of all CML Package Styles, Tape and Reel Dimensions and Solder Reflow Profiles are available via the menu on the left.
Note: For the purposes of this page, the physical IC connection descriptions of 'lead', 'leadless' and 'pin' etc. are represented by the single term of 'pin'.

Package Style Diagrams
Style Diagram Description PDF Version Style Diagram Description PDF Version
D1 28-pin SOIC E1 28-pin TSSOP
D2 24-pin SOIC E2 24-pin TSSOP
D3 20-pin SOIC E3 20-pin TSSOP
D4 16-pin SOIC E4 16-pin TSSOP
D5 24-pin SSOP  
D6 28-pin SSOP L1 24-pin PLCC
  L2 24-pin PLCC
J1 14-pin cerdip DIL L3 28-pin PLCC
J2 16-pin cerdip DIL L4 48-pin LQFP
J3 22-pin cerdip DIL L5 - Withdrawn - L5
J4 24-pin cerdip DIL L6 44-pin PLCC
J5 28-pin cerdip DIL L7 44-lead LQFP
  L8 100-pin LQFP
M1 28-pin CLCC L9 64-pin LQFP
  L10 144-pin LQFP
Q1 64-pin VQFN L11 32-pin TQFP
Q2 56-pin VQFN  
Q3 48-pin VQFN P1 8-pin PDIP
Q4 40-pin VQFN P2 14-pin PDIP
Q5 32-pin VQFN P3 16-pin PDIP
P4 24-pin PDIP
     
P6 22-pin PDIP